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applications example grinding disco in tonga

applications example grinding disco in tonga

The Applications of a TAIKO Wafer The TAIKO process is a wafer backgrinding method developed by DISCO This process method leaves a ring approximately 3 mm on the wafer outer edge and thin grinds only the inner area of the backside wafer By leaving this edge ring it is possible to reduce the risks of wafer breakage or edge chipping

Solutions & Cases

  • Granite Crushing And Screening Line In Norway

    Granite Crushing And Screening Line In Norway

    Main Equipments: PE1200×1500 jaw crusher, cone crusher, vibrating scree, vibrating feeder and conveyor....
    Raw Material: granite Capacity: 600t/h Working Period: From March 2014 until now

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  • Cement Grinding Plant

    Cement Grinding Plant

    Cement grinding plant is the final stage in the production of cement, which is separated from the finished cement production units. It mixes cement clinker with other certain amount of mixed materials for grinding, and then produces the finished cement....
    Feeding Size:≤25mm Production Capacity:200t/d-8,000t/d

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  • Gypsum Powder Plant

    Gypsum Powder Plant

    Gypsum powder plant is a kind of micronized line which turns natural dihydrate gypsum ore (raw gypsum) or industrial by-product gypsum (desulphurization gypsum, phosphogypsum, etc.) into construction gypsum (calcined gypsum) through crushing, grinding, he...
    Production Capacity: 1-30 TPH Applied Materials:Feldspar, calcite, talc, barite, fluorite, rare earth, marble, ceramics, bauxite, manganese, phosphate rock, etc.

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  • Potassium Feldspar Grinding Plant

    Potassium Feldspar Grinding Plant

    The feldspar grinding process is the most important of the mill production line, so we must pay attention to the choice of the equipment....
    Feeding Size:≤25-≤30mm Discharging Size:0.125- 0.044mm

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